Balun LDB211G4020C-001 product image

LDB211G4020C-001

$0.07
  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)

SKU:9661a044d6c3 Category: Brand:

  
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LDB211G4020C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB211G4020C-001

  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)
  • Frequency Range:-
  • Impedance - Unbalanced/Balanced:-
  • Phase Difference:-
  • Insertion Loss (Max):-
  • Return Loss (Min):-
  • Package / Case:-
  • Mounting Type:-

Balun datasheet and documents for LDB211G4020C-001

LDB211G4020C-001

Balun Overview

The Murata Electronics LDB211G4020C-001 is a chip multilayer hybrid balun designed for RF signal conditioning applications. It operates within a frequency range of 2.3 GHz to 2.5 GHz, providing impedance transformation between 50 ohms and 200 ohms. The component utilizes a surface-mount 0805 (2012 metric) package, ensuring compact integration into high-density circuit boards. It features a maximum insertion loss of 1.1 dB and supports operation across a temperature range from -40°C to +85°C. The device is RoHS3 compliant and classified under the LDB21 series.

Balun Feature Summary

  • Hybrid construction utilizing multilayer ceramic technology for stable RF performance
  • Integrated impedance matching capability between single-ended and differential lines
  • Compact surface-mount form factor suitable for space-constrained designs

Balun Applications

  • RF front-end modules in wireless communication systems
  • Balanced-to-unbalanced signal conversion in transceivers
  • Impedance matching networks for differential RF circuits

Balun Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS3 compliance status and lot traceability upon receipt. Ensure storage conditions adhere to moisture sensitivity level requirements to maintain solderability and electrical integrity during assembly processes.

Balun Selection Notes

Select this component when a 50-ohm to 200-ohm impedance transformation is required within the 2.3-2.5 GHz band. Evaluate thermal management capabilities against the specified operating temperature range. Consider the 0805 footprint constraints relative to available board space and routing density requirements for optimal placement.

Balun Part Context

This part belongs to the LDB21 series of chip multilayer hybrid baluns manufactured by Murata Electronics. These components are engineered for microwave and RF applications requiring reliable phase and amplitude balance. The series offers various impedance configurations and frequency ranges to support diverse wireless standard implementations.

Balun Replacement Considerations

LDB181G7FAAEA046 is identified as a similar replacement option provided by Murata Electronics.

LDB211G4020C-001LDB211G4020C-001
$0.07
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