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LDB211G4020C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.
The Murata Electronics LDB211G4020C-001 is a chip multilayer hybrid balun designed for RF signal conditioning applications. It operates within a frequency range of 2.3 GHz to 2.5 GHz, providing impedance transformation between 50 ohms and 200 ohms. The component utilizes a surface-mount 0805 (2012 metric) package, ensuring compact integration into high-density circuit boards. It features a maximum insertion loss of 1.1 dB and supports operation across a temperature range from -40°C to +85°C. The device is RoHS3 compliant and classified under the LDB21 series.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS3 compliance status and lot traceability upon receipt. Ensure storage conditions adhere to moisture sensitivity level requirements to maintain solderability and electrical integrity during assembly processes.
Select this component when a 50-ohm to 200-ohm impedance transformation is required within the 2.3-2.5 GHz band. Evaluate thermal management capabilities against the specified operating temperature range. Consider the 0805 footprint constraints relative to available board space and routing density requirements for optimal placement.
This part belongs to the LDB21 series of chip multilayer hybrid baluns manufactured by Murata Electronics. These components are engineered for microwave and RF applications requiring reliable phase and amplitude balance. The series offers various impedance configurations and frequency ranges to support diverse wireless standard implementations.
LDB181G7FAAEA046 is identified as a similar replacement option provided by Murata Electronics.
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