LDB211G8005C-001

Balun Overview

The LDB211G8005C-001 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates at a center frequency of 1.8 GHz with a 50 Ohm impedance. The component utilizes SMD/SMT termination and is housed in an 0805 (2012 metric) package. It supports board mounting and functions within a temperature range of -40°C to +85°C.

Balun Feature Summary

• Hybrid balun design for signal conditioning
• Multilayer chip construction

Balun Applications

• RF circuit signal balancing
• Wireless communication modules
• Mobile device antenna interfaces

Balun Procurement Notes

This component is listed as no longer manufactured or discontinued by the manufacturer. Availability is limited to existing stock from third-party distributors. Verify authenticity and condition carefully when sourcing from non-original suppliers, as supply chain integrity cannot be guaranteed for obsolete parts.

Balun Selection Notes

Select this part only if the specific 1.8 GHz frequency and 50 Ohm impedance match the design requirements. Consider the 0805 footprint constraints and operating temperature limits. Due to its discontinued status, alternative components with similar RF performance characteristics should be evaluated for long-term production viability.

Balun Part Context

The LDB211 series represents Murata's line of chip multilayer hybrid baluns designed for RF applications. These components are typically used in wireless devices requiring balanced-to-unbalanced signal conversion. The LDB211G8005C-001 is a specific variant within this family, distinguished by its 1.8 GHz operational frequency.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. As the part is discontinued, engineers must identify equivalent baluns based on electrical specifications such as frequency, impedance, and package size from other manufacturers.