SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
LDB211G8105C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.
The LDB211G8105C-001 is a multilayer hybrid balun from Murata Electronics, designed for RF signal conditioning. It operates at a frequency of 1.81 GHz with a balanced/unbalanced impedance of 50/50 Ohms. The component features a maximum insertion loss of 1.1 dB and utilizes an 0805 (2012 metric) surface-mount package. It supports soldering via SMD/SMT termination types and functions within a temperature range of -40°C to +85°C. This device complies with RoHS3 directives and carries an MSL rating of 1.
Verify current availability status as the component is listed as obsolete or end-of-life by major distributors. Confirm if alternative stock sources exist or if a direct replacement from the same manufacturer family is required. Check specific lot dates and storage conditions if procuring from secondary markets. Ensure compliance with RoHS3 standards matches project requirements.
Select this component only if the application requires a 50/50 Ohm balun at 1.81 GHz in an 0805 footprint. Consider the 1.1 dB insertion loss limit against system budget constraints. Evaluate thermal performance within the specified -40°C to +85°C operating range. Verify that the surface-mount package aligns with existing PCB layout capabilities.
This part belongs to the LDB21 series of hybrid baluns manufactured by Murata Electronics. These components are engineered for radio frequency applications requiring balanced-to-unbalanced transformation. The series typically offers various impedance configurations and frequency points within standard surface-mount packages like 0805.
Public confirmed substitute part numbers: None identified.
Explore related parts through RF and Wireless, all product categories, ChipApex homepage.