Balun LDB211G8110C-001 product image

LDB211G8110C-001

$0.07
  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)

SKU:880b420c7e76 Category: Brand:

  
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LDB211G8110C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB211G8110C-001

  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)
  • Frequency Range:1.71GHz ~ 1.91GHz
  • Impedance - Unbalanced/Balanced:50 / 100Ohm
  • Phase Difference:-
  • Insertion Loss (Max):0.9dB
  • Return Loss (Min):-
  • Package / Case:0805 (2012 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for LDB211G8110C-001

LDB211G8110C-001

Balun Overview

The LDB211G8110C-001 is a hybrid balun manufactured by Murata Electronics, designed for signal conditioning applications. It operates within a frequency range of 1.71 GHz to 1.91 GHz, centered around 1.81 GHz with a bandwidth of 200 MHz. The component features an impedance transformation from 50 Ohms unbalanced to 100 Ohms balanced. It utilizes SMD/SMT termination and is housed in a compact 0805 (2012 metric) package. The device supports board mounting and functions reliably within an operating temperature range of -40°C to +85°C.

Balun Feature Summary

  • Provides differential-to-single-ended conversion via hybrid balun architecture
  • Supports high-frequency signal integrity in compact surface-mount form factor
  • Ensures stable performance across industrial temperature extremes

Balun Applications

  • RF front-end modules in wireless communication systems
  • Signal conditioning in cellular infrastructure equipment
  • Balanced line interfacing in microwave components

Balun Procurement Notes

Verify the specific part number against official Murata documentation to confirm current lifecycle status, as availability may vary. Ensure compatibility with existing RF circuit designs regarding impedance matching and thermal requirements. Cross-reference datasheet specifications for precise electrical characteristics before integration into production systems.

Balun Selection Notes

Select this component for applications requiring precise 50-ohm to 100-ohm impedance transformation at frequencies near 1.8 GHz. Consider the 0805 package size for space-constrained PCB layouts. Evaluate thermal management capabilities given the specified operating temperature range to ensure long-term reliability in demanding environments.

Balun Part Context

This component belongs to the LDB series of chip multilayer hybrid baluns produced by Murata Electronics. These devices are engineered for high-performance RF applications, offering reliable signal balancing and impedance conversion. The series is widely utilized in modern electronic systems where compact size and consistent electrical performance are critical design factors.

Balun Replacement Considerations

Consult official Murata documentation for verified substitute part numbers. Do not assume cross-compatibility with other balun models without confirming electrical parameter alignment and physical footprint dimensions.

LDB211G8110C-001LDB211G8110C-001
$0.07
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