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LDB211G8110C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.
The LDB211G8110C-001 is a hybrid balun manufactured by Murata Electronics, designed for signal conditioning applications. It operates within a frequency range of 1.71 GHz to 1.91 GHz, centered around 1.81 GHz with a bandwidth of 200 MHz. The component features an impedance transformation from 50 Ohms unbalanced to 100 Ohms balanced. It utilizes SMD/SMT termination and is housed in a compact 0805 (2012 metric) package. The device supports board mounting and functions reliably within an operating temperature range of -40°C to +85°C.
Verify the specific part number against official Murata documentation to confirm current lifecycle status, as availability may vary. Ensure compatibility with existing RF circuit designs regarding impedance matching and thermal requirements. Cross-reference datasheet specifications for precise electrical characteristics before integration into production systems.
Select this component for applications requiring precise 50-ohm to 100-ohm impedance transformation at frequencies near 1.8 GHz. Consider the 0805 package size for space-constrained PCB layouts. Evaluate thermal management capabilities given the specified operating temperature range to ensure long-term reliability in demanding environments.
This component belongs to the LDB series of chip multilayer hybrid baluns produced by Murata Electronics. These devices are engineered for high-performance RF applications, offering reliable signal balancing and impedance conversion. The series is widely utilized in modern electronic systems where compact size and consistent electrical performance are critical design factors.
Consult official Murata documentation for verified substitute part numbers. Do not assume cross-compatibility with other balun models without confirming electrical parameter alignment and physical footprint dimensions.
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