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LDB211G8120C-002 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.
The LDB211G8120C-002 is a multi-layer hybrid balun manufactured by Murata Electronics, designed for RF signal processing. It operates within a frequency range of 1710 MHz to 1910 MHz, centered at 1.81 GHz. The component provides an impedance transformation from 50 Ohms to 200 Ohms. It is housed in a compact 0805 (2012 Metric) surface-mount package with SMD/SMT termination. The device supports a minimum operating temperature of -40°C and a maximum of +85°C.
Verify the specific datasheet version and RoHS compliance status directly with Murata Electronics or authorized distributors before procurement. Ensure that the 0805 footprint dimensions align with the target PCB layout. Confirm that the specified operating temperature range meets the environmental requirements of the final application assembly.
Select this component when a 50 Ohm to 200 Ohm impedance transformation is required within the GSM/EDGE frequency band. The choice depends on the need for a hybrid balun solution in a small 0805 package. Evaluate thermal performance against the +85°C maximum limit and ensure the design accommodates the specific impedance characteristics for optimal signal integrity.
This part belongs to the LDB series of multi-layer hybrid baluns from Murata Electronics. These components are categorized under signal conditioning and filters. The series is engineered for high-frequency applications requiring precise impedance balancing and compact integration in modern electronic systems.
Consult official Murata documentation for direct substitutes. Verify electrical compatibility regarding the 1710-1910 MHz range and 50/200 Ohm impedance ratio. Ensure any alternative maintains the 0805 package size and -40°C to +85°C operating temperature specifications.
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