Balun LDB211G8120C-002 product image

LDB211G8120C-002

$0.07
  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)

SKU:59ddb7a81e57 Category: Brand:

  
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LDB211G8120C-002 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB211G8120C-002

  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)
  • Frequency Range:1.71GHz ~ 1.91GHz
  • Impedance - Unbalanced/Balanced:50 / 200Ohm
  • Phase Difference:-
  • Insertion Loss (Max):0.9dB
  • Return Loss (Min):-
  • Package / Case:0805 (2012 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for LDB211G8120C-002

LDB211G8120C-002

Balun Overview

The LDB211G8120C-002 is a multi-layer hybrid balun manufactured by Murata Electronics, designed for RF signal processing. It operates within a frequency range of 1710 MHz to 1910 MHz, centered at 1.81 GHz. The component provides an impedance transformation from 50 Ohms to 200 Ohms. It is housed in a compact 0805 (2012 Metric) surface-mount package with SMD/SMT termination. The device supports a minimum operating temperature of -40°C and a maximum of +85°C.

Balun Feature Summary

  • Multi-layer hybrid construction for balanced-to-unbalanced signal conversion
  • Integrated impedance matching between 50 Ohm and 200 Ohm systems
  • Compact 0805 surface-mount form factor for space-constrained designs

Balun Applications

  • RF front-end modules in wireless communication devices
  • Balanced antenna interface circuits
  • Signal conditioning in mobile terminal hardware

Balun Procurement Notes

Verify the specific datasheet version and RoHS compliance status directly with Murata Electronics or authorized distributors before procurement. Ensure that the 0805 footprint dimensions align with the target PCB layout. Confirm that the specified operating temperature range meets the environmental requirements of the final application assembly.

Balun Selection Notes

Select this component when a 50 Ohm to 200 Ohm impedance transformation is required within the GSM/EDGE frequency band. The choice depends on the need for a hybrid balun solution in a small 0805 package. Evaluate thermal performance against the +85°C maximum limit and ensure the design accommodates the specific impedance characteristics for optimal signal integrity.

Balun Part Context

This part belongs to the LDB series of multi-layer hybrid baluns from Murata Electronics. These components are categorized under signal conditioning and filters. The series is engineered for high-frequency applications requiring precise impedance balancing and compact integration in modern electronic systems.

Balun Replacement Considerations

Consult official Murata documentation for direct substitutes. Verify electrical compatibility regarding the 1710-1910 MHz range and 50/200 Ohm impedance ratio. Ensure any alternative maintains the 0805 package size and -40°C to +85°C operating temperature specifications.

LDB211G8120C-002LDB211G8120C-002
$0.07
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