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LDB211G9005C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.
The LDB211G9005C-001 is a hybrid balun from Murata Electronics designed for signal conditioning applications. It operates within a frequency range of 1900 ±100 MHz, providing balanced-to-unbalanced conversion for RF circuits. The component features a 50 Ohm impedance configuration with SMD/SMT termination types suitable for surface mount assembly. Packaged in an 0805 (2012 metric) footprint, it supports board mounting and functions reliably across a temperature range of -40°C to +85°C. This part belongs to the LDB series and is RoHS compliant.
Verify current lifecycle status as this component may be obsolete or discontinued. Confirm availability through authorized distributors only. Ensure compliance with RoHS standards and check for lead-free specifications. Validate package integrity upon receipt. Cross-reference datasheet revisions to ensure compatibility with design requirements.
Select this component when a 50 Ohm hybrid balun is required for 1.9 GHz operations. Consider the 0805 footprint for PCB layout constraints. Evaluate thermal performance within the specified -40°C to +85°C range. Compare insertion loss and return loss parameters against system requirements. Ensure impedance matching between balanced and unbalanced ports.
Part of the LDB21 series of hybrid baluns from Murata Electronics. Designed for high-frequency signal conditioning in compact form factors. Shares similar packaging and mounting characteristics with other components in the LDB family. Targets applications requiring reliable RF signal conversion in consumer electronics and wireless infrastructure.
Public confirmed substitute part numbers are not available in the provided documentation. Consult Murata Electronics directly for end-of-life notifications or recommended alternatives. Verify electrical compatibility if considering cross-brand solutions.
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