LDB211G9020C-001

Balun Overview

The LDB211G9020C-001 is a chip multilayer hybrid balun manufactured by Murata Electronics, designed for signal conditioning applications. It operates within a frequency range of 1800 MHz to 2000 MHz, with a center frequency of 1.9 GHz. The component provides an impedance transformation between unbalanced and balanced ports, specifically 50 Ohms and 200 Ohms respectively. It utilizes surface mount technology (SMD/SMT) and is housed in a compact 0805 (2012 metric) package. The device supports board mounting and functions reliably within an operating temperature range from -40°C to +85°C.

Balun Feature Summary

• Hybrid balun architecture utilizing chip multilayer technology for RF signal conversion
• Impedance matching capability between 50 Ohm and 200 Ohm transmission lines
• Surface mount construction optimized for automated PCB assembly processes

Balun Applications

• RF front-end modules requiring balanced-to-unbalanced signal conversion
• Wireless communication systems operating in the 1.8 GHz to 2.0 GHz band
• Signal conditioning circuits in mobile devices and IoT hardware

Balun Procurement Notes

Verify the specific datasheet version for the LDB211G9020C-001 to confirm current manufacturing status and compliance details. Ensure that the required impedance ratio and frequency range align precisely with the circuit design specifications before finalizing procurement decisions. Cross-reference official Murata documentation for any recent product change notices or environmental compliance updates.

Balun Selection Notes

Select this component when a 50/200 Ohm impedance transformation is required at 1.9 GHz. The 0805 package size offers a balance between performance and space constraints. Consider the operational temperature range of -40°C to +85°C for environmental suitability. Verify that the hybrid balun topology meets the system's phase and amplitude balance requirements compared to alternative transformer types.

Balun Part Context

This part belongs to the LDB series of chip multilayer hybrid baluns from Murata Electronics. These components are engineered for microwave and RF applications where compact size and reliable signal integrity are critical. The LDB211G9020C-001 represents a specific configuration within this family, tailored for the 1.8–2.0 GHz frequency spectrum with distinct impedance characteristics suitable for specialized RF interfaces.

Balun Replacement Considerations

Publicly confirmed substitute part numbers for this specific model were not identified in the provided source material. Designers should consult official Murata documentation for potential obsolescence management or direct replacements if availability becomes an issue.