Balun LDB212G4010C-001 product image

LDB212G4010C-001

$0.20
  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:4c5be213c725 Category: Brand:

  
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LDB212G4010C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB212G4010C-001

  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:2.3GHz ~ 2.5GHz
  • Impedance - Unbalanced/Balanced:50 / 100Ohm
  • Phase Difference:-
  • Insertion Loss (Max):1.0dB
  • Return Loss (Min):-
  • Package / Case:0805 (2012 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for LDB212G4010C-001

LDB212G4010C-001

Balun Overview

The LDB212G4010C-001 is a chip multilayer hybrid balun manufactured by Murata Electronics, designed for signal conditioning applications. It operates within a frequency range of 2.3 GHz to 2.5 GHz and provides an impedance transformation from 50 Ohms (unbalanced) to 100 Ohms (balanced). The component utilizes surface mount technology in a compact 0805 (2012 metric) package. It supports board mounting and functions reliably across a temperature range of -40°C to +85°C. The device features a maximum insertion loss of 1.0 dB and is supplied in tape and reel packaging for automated assembly processes.

Balun Feature Summary

  • Hybrid balun design for RF signal conversion
  • Compact 0805 surface mount footprint
  • Wide operational temperature capability

Balun Applications

  • RF front-end modules
  • Wireless communication systems
  • Balanced-to-unbalanced signal conversion

Balun Procurement Notes

Verify the current lifecycle status before procurement, as this specific part number may be obsolete or discontinued. Confirm that the 100 Ohm balanced impedance aligns with the target circuit requirements. Ensure the 0805 package dimensions fit the designated PCB layout. Check for RoHS compliance documentation if required by project specifications. Validate availability through authorized distributors due to potential supply chain changes.

Balun Selection Notes

Select this component when a 2.3–2.5 GHz hybrid balun with 50/100 Ohm impedance transformation is required. The 0805 package size suits space-constrained designs. Consider the 1.0 dB insertion loss specification for efficiency needs. Verify thermal stability requirements against the -40°C to +85°C operating range. Ensure compatibility with standard SMT reflow processes for the specified end termination type.

Balun Part Context

This component belongs to the LDB series of chip multilayer hybrid baluns from Murata Electronics. These devices are engineered for high-frequency RF applications requiring precise impedance matching. The LDB212G4010C-001 specifically targets the 2.3–2.5 GHz band, distinguishing it from other variants in the family that may operate at different frequencies or impedances. It represents a specialized passive component for signal integrity management.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available for this component.

LDB212G4010C-001LDB212G4010C-001
$0.20
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