Balun LDB213G7010C-002 product image

LDB213G7010C-002

$0.07
  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)

SKU:c7c27a79da5a Category: Brand:

  
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LDB213G7010C-002 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB213G7010C-002

  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)
  • Frequency Range:3.4GHz ~ 4GHz
  • Impedance - Unbalanced/Balanced:50 / 100Ohm
  • Phase Difference:-
  • Insertion Loss (Max):1.1dB
  • Return Loss (Min):-
  • Package / Case:0805 (2012 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for LDB213G7010C-002

LDB213G7010C-002

Balun Overview

The LDB213G7010C-002 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates within a frequency range of 3.4 GHz to 4 GHz, with a center frequency specification of 3.7 GHz and a bandwidth of 600 MHz. The component provides an impedance transformation from 50 Ohms to 100 Ohms. It utilizes a surface-mount device (SMD/SMT) termination style and is housed in a compact 0805 (2012 Metric) package.

Balun Feature Summary

  • Hybrid construction utilizing multilayer technology for balanced signal conversion
  • Designed for high-frequency RF applications requiring precise impedance matching
  • Compact form factor suitable for space-constrained electronic designs

Balun Applications

  • RF front-end modules in wireless communication systems
  • Balanced-to-unbalanced signal conversion circuits
  • High-frequency impedance matching networks

Balun Procurement Notes

Verify the specific manufacturer part number against official Murata documentation to ensure authenticity. Confirm that the component meets the required frequency and impedance specifications for your design. Check for any recent lifecycle updates or obsolescence notices directly from the manufacturer. Ensure compatibility with your assembly process regarding the SMD package type.

Balun Selection Notes

Select this component when a 50 to 100 Ohm impedance transformation is required in the 3.4 to 4 GHz range. Consider the 0805 package size for board layout constraints. Evaluate the hybrid balun technology benefits over discrete solutions for performance and space efficiency. Verify thermal and electrical requirements align with the component's operational characteristics.

Balun Part Context

This component belongs to the LDB series of chip multilayer hybrid baluns produced by Murata Electronics. These devices are engineered for RF applications where balanced signals must be converted to unbalanced signals or vice versa. The series offers various impedance ratios and frequency ranges to suit different wireless standards and system requirements.

Balun Replacement Considerations

Consult official Murata documentation for verified substitute part numbers. Cross-reference specifications such as frequency range, impedance ratio, and package dimensions to ensure functional equivalence. Do not assume generic baluns are interchangeable without verifying technical parameters.

LDB213G7010C-002LDB213G7010C-002
$0.07
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