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LDB215G2510C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.
The LDB215G2510C-001 is a chip multilayer hybrid balun manufactured by Murata Electronics, designed for signal conditioning applications. It operates at a center frequency of 5.25 GHz with a bandwidth of 200 MHz, covering the range from 5150 MHz to 5350 MHz. The component provides an impedance transformation between unbalanced and balanced ports of 50 Ohms and 100 Ohms, respectively. It utilizes surface mount technology (SMD/SMT) in a 0805 (2012 metric) package. The device functions within a temperature range of -40°C to +85°C and weighs approximately 5.5 mg.
Verify current availability status as this part may be obsolete or end-of-life. Confirm RoHS compliance and REACH status prior to integration. Ensure the specific ordering suffix matches design requirements. Check for valid replacement components if production continuity is required. Validate datasheet revisions against current manufacturing standards.
Select this component for high-frequency applications requiring precise 50-to-100 Ohm impedance transformation. The 0805 package size suits space-constrained PCB layouts. Consider the operating temperature range for environmental suitability. Verify insertion loss specifications against system budget requirements. Ensure compatibility with standard SMT reflow processes.
This component belongs to the LDB21 series of hybrid baluns from Murata Electronics. It is categorized under signal conditioning products within the broader filter and passive component portfolio. The series is designed for RF and wireless applications requiring balanced-to-unbalanced signal conversion.
Publicly confirmed substitute part numbers are not available in the provided documentation. Consult manufacturer resources for direct replacements.
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