LDB215G5105C-001

Balun Overview

The LDB215G5105C-001 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates within a frequency range of 5.149 GHz to 5.875 GHz, with a center frequency of 6.61 GHz. The component features a nominal impedance of 50 Ohms for both unbalanced and balanced ports. It is housed in an 0805 (2012 metric) surface-mount package with dimensions of 2.0 mm x 1.25 mm x 0.5 mm. The device supports a maximum power capacity of 1W and exhibits a maximum insertion loss of 1.25 dB. It functions reliably across an operating temperature range from -40°C to +85°C.

Balun Feature Summary

• Provides signal conversion between single-ended and differential signals using hybrid balun technology.
• Designed for high-frequency RF applications with a specific operational bandwidth centered at 6.61 GHz.
• Utilizes a compact 0805 surface-mount package suitable for space-constrained circuit board layouts.

Balun Applications

• RF front-end modules in wireless communication devices
• Differential-to-single-ended signal conversion circuits
• High-frequency antenna interface networks

Balun Procurement Notes

Verify the current lifecycle status before integration, as this component may be designated as Not For New Designs. Confirm that the specified 0805 footprint matches your PCB layout requirements. Ensure the operating temperature range aligns with your environmental specifications. Validate impedance matching for your specific 50 Ohm system design. Check for updated replacement part numbers if availability is restricted.

Balun Selection Notes

Select this component when a compact hybrid balun is required for the 5.149 GHz to 5.875 GHz frequency band. Consider the 1W power handling capability for your signal strength requirements. The 0805 package size offers a balance between performance and board space efficiency. Verify that the insertion loss characteristics meet your system's signal integrity standards. Ensure compatibility with standard SMD assembly processes.

Balun Part Context

This part belongs to Murata's LDB series of chip multilayer hybrid baluns. These components are engineered for signal conditioning in RF circuits. The series provides reliable performance for converting between unbalanced and balanced signals. They are commonly used in modern electronic devices requiring efficient RF signal management.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official Murata resources for potential alternatives if this component is obsolete or unavailable for new designs.