LDB311G7010C-300

Balun Overview

The LDB311G7010C-300 is a multi-layer hybrid balun manufactured by Murata Electronics, designed for RF signal conditioning applications. It operates within a frequency range of 1.6 GHz to 1.8 GHz, centered around 1.7 GHz. The component provides impedance transformation between differential and single-ended lines, featuring a 50 Ohm single-ended port and a 100 Ohm differential port. Packaged in a compact 1206 (3216 Metric) surface-mount footprint, it supports high-volume production environments. The device is RoHS compliant and lead-free, ensuring adherence to environmental standards for electronic components used in modern wireless communication systems.

Balun Feature Summary

• Multi-layer hybrid construction for stable RF performance
• Integrated impedance matching between 50 and 100 Ohm ports
• Compact 1206 surface-mount package design

Balun Applications

• RF front-end modules in mobile devices
• Wireless LAN transceivers
• Bluetooth low energy circuits

Balun Procurement Notes

Verify the specific suffix '300' corresponds to the required tape-and-reel packaging configuration when placing orders. Confirm that the 1.6–1.8 GHz operational bandwidth aligns with the target system's frequency requirements. Ensure compatibility with standard reflow soldering profiles for 1206 packages. Cross-reference the manufacturer's latest datasheet to confirm current RoHS compliance status and material declarations before finalizing procurement specifications.

Balun Selection Notes

Select this component when a balanced-to-unbalanced conversion is required at 1.7 GHz with specific 50/100 Ohm impedance ratios. The 1206 package size suits space-constrained PCB layouts. Consider thermal management capabilities up to +85°C for reliable operation in consumer electronics. Evaluate insertion loss and return loss parameters from the official datasheet to ensure signal integrity meets system specifications.

Balun Part Context

This part belongs to Murata's LDB series of chip multilayer hybrid baluns. These components are engineered for signal conditioning in high-frequency applications. The series offers various impedance configurations tailored for different RF interface needs. The LDB311G7010C-300 specifically addresses the need for precise impedance transformation in compact form factors, supporting the miniaturization trends in modern wireless hardware.

Balun Replacement Considerations

Direct substitutes include other Murata LDB series variants such as LDB311G9020C-300, which shares similar packaging but differs in impedance characteristics. Verify pinout compatibility and electrical parameters before substitution. No cross-manufacturer replacements are confirmed in public documentation.