LDB311G8005C-300

Balun Overview

The Murata LDB311G8005C-300 is a chip multilayer hybrid balun designed for RF signal conditioning. It operates within the 1.7 GHz to 1.9 GHz frequency range, centered at 1.8 GHz. The component provides balanced-to-unbalanced conversion with 50 Ohm impedance on both ports. It utilizes surface mount technology in a 1206 (3216 Metric) package. The device supports operation between -40°C and +85°C.

Balun Feature Summary

• Hybrid balun architecture utilizing ceramic multilayer technology
• Optimized for 1.7 GHz to 1.9 GHz wireless frequency applications
• Surface mount design suitable for high-frequency circuit integration

Balun Applications

• Wireless communication systems
• RF front-end modules
• Balanced-to-unbalanced signal conversion circuits

Balun Procurement Notes

Verify component authenticity through authorized Murata distributors or certified supply chain partners. Confirm that the specific part number matches the required 1206 package dimensions and 1.8 GHz operational specifications. Ensure compliance with RoHS status requirements for your manufacturing process. Request official datasheets to validate electrical parameters against system design constraints before procurement.

Balun Selection Notes

Select this component when designing circuits requiring precise impedance matching at 1.8 GHz. The 1206 footprint offers a balance between performance and board space efficiency. Consider thermal management capabilities within the specified temperature range. Evaluate return loss characteristics to ensure signal integrity in high-frequency transmission lines.

Balun Part Context

This component belongs to the LDB series of chip multilayer hybrid baluns manufactured by Murata Electronics. These devices are engineered for RF applications requiring reliable signal conversion. The series utilizes copper conductors and ceramic materials to support high-frequency operations.

Balun Replacement Considerations

Public confirmed substitute part numbers: None identified.