Balun LDB311G8020C-300 product image

LDB311G8020C-300

$0.13
  • Description:MULTI-LAY HYBRID BALUNS 1206
  • Series:LDB31
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)

SKU:0c093e3fb307 Category: Brand:

  
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LDB311G8020C-300 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 1206. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB311G8020C-300

  • Description:MULTI-LAY HYBRID BALUNS 1206
  • Series:LDB31
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)
  • Frequency Range:1.7GHz ~ 1.9GHz
  • Impedance - Unbalanced/Balanced:50 / 200Ohm
  • Phase Difference:-
  • Insertion Loss (Max):0.8dB
  • Return Loss (Min):-
  • Package / Case:1206 (3216 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for LDB311G8020C-300

LDB311G8020C-300

Balun Overview

The Murata LDB311G8020C-300 is a chip multilayer hybrid balun designed for RF applications. It operates within a frequency range of 1.7 GHz to 1.9 GHz, centered at 1.8 GHz. The component provides an impedance transformation from 50 Ohms to 200 Ohms. It utilizes a surface-mount device (SMD/SMT) termination style and is housed in a 1206 (3216 metric) package. The construction employs copper conductors and ceramic materials suitable for high-frequency performance.

Balun Feature Summary

  • Utilizes chip multilayer hybrid technology with copper conductors and ceramic materials
  • Provides balanced-to-unbalanced signal conversion between 50 Ohm and 200 Ohm impedances
  • Engineered for operation in the 1.7 GHz to 1.9 GHz frequency band

Balun Applications

  • RF front-end circuits requiring impedance matching
  • Wireless communication systems operating in the 1.8 GHz band
  • Embedded electronics utilizing surface-mount assembly

Balun Procurement Notes

Verify the specific ordering suffix to ensure compliance with RoHS standards and lead-free requirements. Confirm that the 1206 package dimensions align with the target PCB footprint. Cross-reference the manufacturer part number against official Murata documentation to distinguish this variant from other LDB series components with different impedance or frequency specifications.

Balun Selection Notes

Select this component when a 50 Ohm to 200 Ohm impedance transformation is required within the 1.7–1.9 GHz range. Ensure the design accommodates the 1206 surface-mount form factor. Consider the multilayer hybrid construction for stability in high-frequency environments. Validate that the application does not require alternative impedance ratios or frequency bands covered by other LDB series variants.

Balun Part Context

This balun belongs to the Murata LDB series of chip multilayer hybrid baluns. These components are characterized by their use of copper conductors and ceramic materials, making them suitable for high-frequency applications. The series offers various impedance configurations and package sizes to support diverse RF circuit designs.

Balun Replacement Considerations

Consult official Murata documentation for direct substitutes within the LDB series. Verify that any replacement maintains the 1.7–1.9 GHz frequency range and 50/200 Ohm impedance ratio. Ensure package compatibility and electrical parameter alignment before substitution.

LDB311G8020C-300LDB311G8020C-300
$0.13
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