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LDB311G9005C-300 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 1206. Review the specifications below when checking this part for your BOM.
The Murata LDB311G9005C-300 is a multi-layer hybrid RF balun designed for signal conditioning applications. It operates within a frequency range of 1800 MHz to 2000 MHz, centered at 1.9 GHz. The component features 50 Ohm impedance for both balanced and unbalanced ports. It is housed in a compact 1206 (3216 Metric) surface-mount package. Constructed with copper conductors and ceramic materials, it supports high-frequency operations. The device is RoHS compliant and lead-free.
Verify the specific suffix -300 against official Murata documentation to confirm the exact frequency tolerance and impedance matching characteristics. Confirm RoHS compliance status through current manufacturer declarations. Check lifecycle status as some sources indicate obsolescence. Ensure the 1206 package dimensions match your PCB footprint requirements before procurement.
Select this component when a 50 Ohm to 50 Ohm balun is required for the 1800-2000 MHz range. The 1206 package offers a balance between performance and board space. Consider thermal management if operating near maximum temperature limits. Verify that the multi-layer hybrid construction meets the environmental reliability standards of the target application.
This part belongs to Murata's LDB series of chip-type multi-layer mixed baluns. These components are engineered for high-frequency applications using ceramic and copper materials. The series provides solutions for converting differential signals to single-ended signals in compact form factors suitable for modern electronic devices.
Publicly confirmed substitute part numbers are not available in the provided source data. Consult Murata Electronics directly for qualified replacements or alternative parts within the LDB series that meet the same electrical specifications.
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