SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
LDB31900M05C-417 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 1206. Review the specifications below when checking this part for your BOM.
The LDB31900M05C-417 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates within a frequency range of 800MHz to 1GHz, centered at 900MHz with a bandwidth of 200MHz. The component provides an impedance transformation from 50 Ohms unbalanced to 50 Ohms balanced. It features a maximum insertion loss of 0.8dB and is designed for surface mount installation in a 1206 (3216 Metric) package.
Verify the part status as obsolete before procurement planning. Confirm that the 1206 package dimensions align with existing PCB footprints. Ensure the 800MHz to 1GHz frequency range meets specific application requirements. Check for available replacement components due to end-of-life status.
Select this component when a 50/50 Ohm impedance balance is required in the 900MHz band. Consider the 0.8dB insertion loss limit for signal integrity needs. Evaluate the 1206 footprint constraints against board space limitations. Assess compatibility with surface mount reflow processes.
This balun belongs to the LDB31 series of multilayer hybrid baluns from Murata Electronics. These components are engineered for RF applications requiring balanced-to-unbalanced conversion. The series supports various impedance configurations and frequency ranges tailored for wireless technologies.
The LDB31900M05C-417 operates between 800MHz and 1GHz.
The maximum insertion loss is specified as 0.8dB.
Explore related parts through RF and Wireless, all product categories, ChipApex homepage.