LDM182G4510CC001

Balun Overview

The LDM182G4510CC001 is a multi-layer hybrid balun manufactured by Murata Electronics. It operates within the frequency range of 2.4 GHz to 2.5 GHz, supporting applications such as Wi-Fi and Bluetooth. The device provides impedance transformation between 50 ohms unbalanced and 50 ohms balanced ports. Key electrical specifications include a maximum insertion loss of 0.98 dB. The component is designed for surface mount installation in a compact package measuring 1.6 x 0.8 mm with a height of 0.4 mm. It functions reliably across an operating temperature range from -40°C to +85°C.

Balun Feature Summary

• Multi-layer hybrid construction for RF signal balancing
• Compact surface mount footprint suitable for space-constrained designs
• Integrated impedance matching for 50-ohm systems

Balun Applications

• Wireless LAN modules
• Bluetooth transceivers
• Mobile communication devices

Balun Procurement Notes

Verify the specific datasheet version when sourcing, as Murata may update documentation without changing the part number. Confirm that the ordering suffix matches the required packaging format, typically tape and reel for automated assembly. Ensure the supplier provides traceability documents consistent with RoHS compliance standards. Cross-reference the manufacturer's official catalog to confirm current production status before finalizing procurement plans.

Balun Selection Notes

Select this component when designing circuits requiring a balanced-to-unbalanced transformer at 2.45 GHz. The 50/50 ohm configuration suits standard RF front-end architectures. Consider the 0.98 dB insertion loss limit when calculating total link budget. The small 0603-style package allows high-density PCB layouts. Verify thermal performance against the specified -40°C to +85°C operational range for the target environment.

Balun Part Context

This balun belongs to the LDM18 series from Murata Electronics, which focuses on miniaturized RF components for wireless connectivity. The series utilizes multi-layer hybrid technology to achieve high performance in small form factors. These components are engineered to replace discrete transformer solutions, simplifying circuit design and reducing board space requirements for modern mobile and IoT applications.

Balun Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Engineers should consult Murata's official replacement guide or contact technical support directly for validated alternatives.