LEE-39+

Overview

The LEE-39+ is a surface-mount monolithic RF amplifier manufactured by Mini-Circuits, designed for cellular and PCS applications. It operates within a frequency range of 0Hz to 8GHz. Key electrical specifications include a gain of 10.5dB, a noise figure of 2.4dB, and a P1dB output power of 11.6dBm. The device requires an operating supply voltage of 3.5V and draws a current of 35mA. It is housed in the FG873 package.

Feature Summary

• Designed specifically for cellular and PCS wireless communication systems
• Operates across a wide frequency spectrum from DC to 8GHz
• Surface-mount construction for compact circuit integration

Applications

• Cellular base station front-end modules
• PCS system signal amplification
• Wireless communication infrastructure components

Procurement Notes

Verify the exact part number suffix against official Mini-Circuits documentation to ensure correct pinout and performance characteristics. Confirm that the FG873 package matches your PCB footprint requirements. Cross-reference the datasheet specifications with your system's voltage and current constraints before finalizing procurement orders.

Selection Notes

Select this component when a low-noise, moderate-gain amplifier is required for frequencies up to 8GHz. The 3.5V supply requirement suits standard logic levels. Ensure the application can accommodate the specific thermal and impedance matching needs associated with the FG873 surface-mount package for optimal signal integrity.

Part Context

This amplifier belongs to Mini-Circuits' LEE series of monolithic microwave integrated circuits (MMICs). These devices are engineered for high reliability in demanding RF environments. The LEE-39+ serves as a specialized solution for mobile telecommunications bands, offering a balance of gain and noise performance suitable for receiver or transmitter chains.

Replacement Considerations

Consult Mini-Circuits official substitution guides for verified alternatives. Generic cross-references may not match the specific FG873 package dimensions or electrical tolerances. Verify compatibility with existing bias networks and impedance matching circuits before substituting.