LF398MX

Overview

The LF398MX is a monolithic sample and hold amplifier manufactured by Texas Instruments. It utilizes BI-FET technology to provide high-speed acquisition and low droop rates for analog signal processing. The device operates within a supply voltage range of 5 V to 18 V and supports an operating temperature range from 0°C to +70°C. It is housed in a surface-mount SOIC-14 package, designed for integration into data acquisition systems requiring precise temporal sampling of continuous signals.

Feature Summary

• Monolithic construction integrating sample and hold functions on a single chip
• BI-FET input stage providing high input impedance and low bias current
• Designed for fast capture times to minimize aperture delay errors
• Low droop rate characteristics to maintain sampled voltage accuracy

Applications

• Data acquisition systems utilizing multiplexed analog inputs
• Frequency-to-voltage conversion circuits
• Analog-to-digital converter front-end conditioning
• Pulse width modulation signal sampling

Procurement Notes

Verify the specific suffix against the manufacturer's official documentation to confirm pinout compatibility and electrical tolerances. Ensure the ordering part number matches the required package style and temperature grade. Cross-reference the datasheet revision history for any changes in recommended operating conditions or application circuit recommendations prior to final procurement.

Selection Notes

Select this component when a single-channel sample and hold function is required with moderate speed and low cost. Consider the SOIC-14 package constraints for PCB layout and thermal management. Evaluate the capture time specifications against the system's maximum input signal frequency to ensure adequate settling time before the hold phase initiates.

Part Context

The LF398 belongs to the LF398 family of sample and hold amplifiers from Texas Instruments. This series is widely recognized for its general-purpose utility in analog signal processing applications. The MX suffix typically denotes a specific tape-and-reel packaging variant intended for automated surface-mount assembly processes, distinguishing it from through-hole DIP versions.