LFB311G90SG2-797

Overview

The LFB311G90SG2-797 is a chip multilayer LC bandpass filter designed for communication equipment RF and local signal paths. It features a center frequency of 1.9 GHz with a bandwidth of 13.5 MHz. The component operates within a temperature range of -40°C to +85°C and exhibits an insertion loss of 2.7 dB. Packaged in a compact 1206 (3216 Metric) surface-mount footprint, it supports automated assembly processes.

Feature Summary

• Utilizes chip multilayer LC technology for stable high-frequency performance
• Optimized for RF and local signal filtering in communication systems
• Designed for reliable operation across standard industrial temperature ranges

Applications

• RF signal filtering in wireless communication modules
• Local oscillator path filtering in receiver circuits
• Band selection in cellular infrastructure equipment

Procurement Notes

Verify the complete part number including the suffix to ensure correct packaging configuration. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer. Ensure storage conditions align with moisture sensitivity levels specified in the datasheet to maintain component integrity prior to soldering.

Selection Notes

Select this component when a 1.9 GHz center frequency with narrow bandwidth is required for RF applications. Consider the 1206 package size for space-constrained PCB layouts. Evaluate insertion loss specifications against system noise budget requirements. Ensure compatibility with existing impedance matching networks in the signal chain.

Part Context

This component belongs to Murata's family of filters for communication equipment, specifically targeting RF and local signal processing. These ceramic filters are engineered to provide sharp selectivity and low insertion loss, supporting modern wireless standards that demand precise frequency control and interference rejection in compact form factors.

Replacement Considerations

Consult official substitution lists for compatible alternatives. Verify electrical parameters such as center frequency, bandwidth, and insertion loss match original requirements. Ensure physical dimensions and pin configurations are identical to avoid PCB redesign efforts during replacement scenarios.