LFCN-7200+

Overview

The LFCN-7200+ is a surface-mount low-pass filter from Mini-Circuits, utilizing LTCC ceramic technology. It provides a cutoff frequency of 7200 MHz with a 50 Ohm impedance. The device features a compact FV1206 package designed for high-frequency RF and microwave applications. It offers low insertion loss and high attenuation in the stopband, ensuring signal integrity in demanding environments.

Feature Summary

• LTCC ceramic construction for stable high-frequency performance
• Surface-mount design suitable for automated assembly
• High isolation to ground when DC pass is not required

Applications

• RF and microwave circuit filtering
• Signal conditioning in communication systems
• Frequency upconverter assemblies

Procurement Notes

Verify the specific suffix requirements against your schematic. The standard LFCN-7200+ does not support DC continuity between input and output. If DC pass-through is necessary, confirm availability of the 'D' suffix variant which provides greater than 100 MOhm isolation to ground. Ensure the FV1206 footprint matches your PCB layout constraints before ordering.

Selection Notes

Select this component for applications requiring sharp cutoff characteristics above 7 GHz. Consider the LFCN-7200+ where space is limited due to its SMD form factor. Evaluate the need for DC blocking versus DC pass; if DC continuity is essential, the D-suffix version must be selected instead of the standard model to prevent circuit malfunction.

Part Context

This part belongs to Mini-Circuits' LFCN series of low-pass filters. These components are engineered for robustness in harsh environments. The series utilizes Thin-Film and LTCC technologies to achieve consistent electrical performance across wide temperature ranges, making them suitable for industrial and commercial RF infrastructure.

Replacement Considerations

For designs requiring DC pass capability, consider the LFCN-7200-D+ variant. This alternative maintains similar frequency response but allows DC current flow between ports while providing high isolation to ground. Verify that the physical footprint remains compatible if substituting within an existing board design.