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The LFD182G45DP3B888 is a chip multilayer diplexer from Murata Electronics, designed for signal conditioning in RF applications. It operates within two distinct frequency bands: 2.4 GHz to 2.5 GHz and 4.9 GHz to 5.95 GHz. The component utilizes a surface-mount (SMD/SMT) package with dimensions of 1.6 mm x 0.8 mm x 0.7 mm. It features an insertion loss of 0.65 dB at the lower band and 0.85 dB at the higher band. The device supports a minimum operating temperature of -40°C and a maximum of +85°C.
Verify current availability status as this component may be subject to obsolescence notices. Confirm that the specific suffix matches the required electrical specifications, as ordering suffixes can indicate variations in packaging or minor parameter tolerances. Ensure compatibility with existing PCB footprints and reflow soldering profiles before finalizing procurement orders.
Select this diplexer when dual-band isolation between 2.4 GHz and 5 GHz signals is required in a minimal form factor. Consider the 0603 package size for board space limitations. Evaluate the insertion loss values against system link budget requirements. Verify thermal stability needs against the -40°C to +85°C operating range.
This part belongs to the LFD series of chip multilayer diplexers manufactured by Murata Electronics. These components are engineered for high-frequency signal separation in compact electronic devices. The series is commonly integrated into modern wireless communication hardware to manage interference between closely spaced frequency bands.
Check for official substitute part numbers from Murata if this item is discontinued. Verify pinout compatibility and electrical performance equivalence before substituting with other manufacturers' diplexers.