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The IQD LFSPXO082147 is a standard surface-mount clock oscillator from the IQXO-540 series, designed for low-power applications. It operates at a nominal frequency of 8 MHz with a full temperature stability of ±25 ppm over a -20°C to +70°C range. The device utilizes a 3.3V supply and features a CMOS output format with a maximum load capacitance of 15 pF. Housed in a compact 2.0 x 1.6 x 0.8 mm ceramic package with a hermetically sealed metal lid, it ensures reliability without moisture sensitivity limitations.
Verify that the specific order matches the LFSPXO082147 part number to ensure the correct 8 MHz frequency and ±25 ppm stability. Confirm the requirement for the 2x1.6mm package size and hermetic sealing. Ensure the design supports the 3.3V supply voltage and CMOS interface. Check for availability as distribution status may vary by region.
Select this component for designs prioritizing minimal footprint and low quiescent current. The integrated standby pin allows active power management, making it suitable for battery-operated systems. The hermetic seal provides robust environmental protection compared to non-sealed alternatives, simplifying assembly processes by removing baking steps.
This oscillator belongs to the IQXO-540 series, which focuses on small form factors and energy efficiency. The series offers various frequencies and stability options, catering to diverse timing needs in modern electronics while maintaining high reliability through sealed packaging technologies.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing PCB footprints and electrical parameters before considering alternative sources.
When the standby pin is pulled low to less than 30% of Vcc, the device enters standby mode, and the output goes into a high-impedance state, preventing leakage current into the connected MCU.
No, due to the hermetically sealed ceramic package, the component is not subject to Moisture Sensitivity Level (MSL) restrictions, eliminating the need for pre-baking prior to SMT placement.