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LICAL-ENC-MS001 is listed in the Encoders, Decoders, Converters range at ChipApex. The manufacturer field lists TE Connectivity Linx. Its product description is IC REMOTE CONTROL ENCODER 20SSOP. Review the specifications below when checking this part for your BOM.
The LICAL-ENC-MS001 is a remote control encoder integrated circuit manufactured by TE Connectivity Linx Technologies. It belongs to the MS logic series and features an 8-bit configuration with eight input lines. The device operates within a supply voltage range of 2.0 V to 5.5 V and supports surface mount installation in a 20-pin SSOP package (0.209 inch width). It functions reliably across an operating temperature range from -40 °C to +85 °C. The component is RoHS compliant, classified under ECCN EAR99, and holds Moisture Sensitivity Level 1.
Verify the specific ordering suffix required for your packaging preference, such as tape and reel or cut tape, when placing orders. Confirm current availability status directly with authorized distributors, as stock levels fluctuate. Ensure the selected variant matches the required pin count and package dimensions for your PCB layout. Check for any recent design changes or lifecycle notices on the manufacturer's official documentation portal before finalizing procurement plans.
Select this encoder when an 8-bit input capacity is sufficient for the application. Verify that the system power supply remains within the 2.0 V to 5.5 V operational window. Ensure the PCB footprint accommodates the 20-SSOP package dimensions. Consider the -40 °C to +85 °C temperature rating against environmental conditions. Confirm compatibility with the downstream decoder or receiver module in the signal chain.
This component is part of the LICAL-ENC product family, which focuses on remote control encoding solutions. The MS series designation indicates its logical architecture and pinout compatibility within the manufacturer's broader encoder lineup. It serves as a foundational building block for transmitting encoded data in wireless and wired communication protocols.
Consult the official datasheet for direct pin-to-pin replacements within the same MS series. Verify functional equivalence regarding bit depth and voltage requirements before substituting. Cross-reference package dimensions to ensure mechanical fit without PCB redesign.
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