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LM20134MH/NOPB is listed in the Voltage Regulators - DC DC Switching Regulators range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC REG BUCK ADJ 4A 16HTSSOP. Review the specifications below when checking this part for your BOM.
The LM20134MH/NOPB is a 4A pwrWise synchronous buck regulator from Texas Instruments, operating within a 2.95V to 5.5V input voltage range. It features current mode control and an integrated power stage capable of delivering up to 4A output current. The device supports adjustable switching frequencies and includes input synchronization capabilities for noise reduction in multi-rail systems. Designed for high efficiency, it incorporates adaptive on-time control and comprehensive protection features such as overcurrent, thermal, and short-circuit protection.
Verify the exact suffix (NOPB) confirms lead-free and RoHS compliance status against the latest manufacturer datasheet revision. Confirm package marking and pinout compatibility during PCB layout finalization. Check for any specific automotive qualification grades if required by the end application standard. Ensure ordering documentation matches the MH package variant specifications.
Select this component when a compact, high-current step-down solution is needed with input voltage constraints between 2.95V and 5.5V. The integrated design reduces external component count compared to discrete solutions. Consider the input sync feature if system-wide EMI management requires synchronized switching frequencies across multiple power rails.
This part belongs to the LM20134 family of pwrWise synchronous buck regulators. It is designed for applications requiring high efficiency and small footprint. The MH package is a PowerPAD™ thermally enhanced package suitable for surface-mount assembly. It serves as a key component in modern power management architectures for digital loads.
Direct substitutes include other TI 4A synchronous buck regulators with similar input ranges, such as the LM20134MTE/NOPB for different packaging options. Verify pin-to-pin compatibility and thermal performance characteristics before substitution. Cross-reference with non-TI equivalents only if electrical parameters and package dimensions are identical.
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