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LM25085ASDX/NOPB is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC REG CTRLR BUCK 8WSON. Review the specifications below when checking this part for your BOM.
The LM25085ASDX/NOPB is a non-synchronous buck switching controller from Texas Instruments. It operates with an input voltage range of 4.5V to 42V and supports output voltages from 900mV to 42V. The device features a fixed 1MHz switching frequency and delivers up to 1.75A of drive current. It utilizes a constant on-time control architecture for rapid transient response. The component is housed in an 8-WSON (3x3) package and functions within a junction temperature range of -40°C to +125°C.
Verify the specific suffix 'ASDX' against the manufacturer's official datasheet to confirm the exact package type and tape-and-reel specifications. Ensure compatibility with the target PCB footprint, as the WSON-8 package requires precise soldering techniques. Confirm RoHS compliance status through the latest product migration notices before finalizing procurement orders.
Select this controller when a compact solution is required for wide-input buck applications. The constant on-time topology simplifies design by eliminating stability compensation issues common in voltage mode control. Consider the 1.75A drive capability for driving external MOSFETs efficiently at 1MHz frequencies while maintaining low quiescent current operation.
This component belongs to the LM25085A family of non-synchronous buck controllers. It shares architectural similarities with the LM25085 but offers optimized performance characteristics for modern power management needs. The series is designed to replace older generation controllers in space-constrained industrial and automotive designs requiring robust transient performance.
Direct pin-to-pin replacements include the LM25085MM/NOPB and LM25085AMMX/NOPB. Verify that the substitute part matches the required input voltage range and switching frequency. Ensure the replacement package variant aligns with existing board layout constraints and thermal requirements.
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