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The LM258QT is a dual low-power operational amplifier manufactured by STMicroelectronics, housed in an 8-lead DFN surface-mount package. It features two independent, internally frequency-compensated amplifiers designed for single-supply operation across a wide voltage range of 3 V to 30 V. Key electrical specifications include a gain-bandwidth product of 1.1 MHz, a slew rate of 600 mV/µs, and a maximum supply current of 700 µA per channel. The device supports an output short-circuit current of 40 mA and operates within a temperature range of -40°C to +105°C.
Verify the specific suffix 'QT' against the manufacturer's official datasheet to confirm the exact tape-and-reel packaging configuration and quantity. Ensure the component matches the required DFN-8 footprint and thermal pad specifications for your PCB layout. Cross-reference the date code and lot number with the supplier's certificate of conformity to guarantee authenticity and traceability before finalizing procurement.
Select this component when designing circuits that require low quiescent current and single-supply operation from 3 V to 30 V. It is suitable for applications where internal frequency compensation simplifies the design process. Consider the DFN-8 package for space-constrained surface-mount assemblies. Verify that the 40 mA output drive capability meets the load requirements and that the 1.1 MHz bandwidth is sufficient for the signal frequencies involved.
This part belongs to the LM258 series of dual operational amplifiers known for their versatility in single-supply applications. The LM258QT variant specifically utilizes a DFN-8 package, distinguishing it from other pin-compatible variants like the SOIC or TSSOP versions. It shares core electrical characteristics with the broader LM258 family but offers distinct physical dimensions and thermal properties associated with the DFN form factor.
LM258D: Pin-compatible alternative in SOIC-8 package with similar electrical characteristics. LM258PT: Pin-compatible alternative in TSSOP-8 package. Verify package dimensions and thermal performance differences when substituting.