LM285D-2.5R2

Overview

The LM285D-2.5R2G is a micropower shunt voltage reference manufactured by onsemi, housed in an 8-SOIC surface-mount package. It provides a fixed output voltage of 2.5V with an initial accuracy of ±1.5%. The device operates within a temperature range of -40°C to +85°C and features a standard temperature coefficient of 80ppm/°C. It supports a maximum shunt current of 20mA and includes low noise characteristics.

Feature Summary

• Utilizes a shunt reference topology for stable voltage regulation
• Provides precise fixed output voltage with tight initial tolerance
• Designed for surface-mount assembly in compact electronic circuits

Applications

• Analog-to-digital converter (ADC) reference sources
• Precision measurement instrumentation
• Battery-powered monitoring systems

Procurement Notes

Verify the complete part number suffix, typically 'G' or 'R2G', as the input model appears truncated. Confirm the specific accuracy grade and packaging format required for the application. Ensure compatibility with the 8-SOIC footprint and check for lead-free compliance status if mandated by project specifications before finalizing procurement.

Selection Notes

Select this component when a stable 2.5V reference is needed in space-constrained designs requiring surface-mount technology. Consider the ±1.5% accuracy and 80ppm/°C temperature coefficient against stricter requirements. Evaluate the 20mA current limit to ensure adequate headroom for the load circuit while maintaining micropower efficiency.

Part Context

This device belongs to the LM285 series of two-terminal bandgap voltage references produced by onsemi. It shares functional similarities with other industry-standard references but offers specific packaging and performance attributes tailored for modern surface-mount manufacturing processes and general-purpose precision applications.

Replacement Considerations

Compatible substitutes include the LM285D-2.5G from onsemi and the LM285I-2.5/NOPB from Texas Instruments. Verify pinout compatibility and thermal resistance differences when transitioning between manufacturers to ensure proper circuit integration.