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The LM393LVQDGKRQ1 is a dual low-voltage rail-to-rail input comparator from Texas Instruments, designed for automotive applications. It operates on a single supply voltage ranging from 1.65V to 5.5V. Key electrical parameters include an input offset voltage of 400µV and an input bias current of 5pA. The device features a propagation delay of 600ns and a common-mode rejection ratio (CMRR) of 65dB. It draws a typical quiescent current of 25µA per channel. The operating temperature range spans from -40°C to +125°C. The output stage is open-drain, requiring an external pull-up resistor.
Verify the specific ordering suffix 'DGKR' corresponds to the VSSOP-8 package and reel quantity requirements. Confirm that the Q1 designation aligns with your project's automotive qualification standards. Ensure the datasheet revision matches your design specifications. Cross-reference the pinout with your PCB layout to avoid orientation errors during assembly.
Select this component when low supply voltage operation below 2.7V is required compared to standard LM393 variants. Choose this part for applications needing rail-to-rail input performance to maximize dynamic range. Consider this device for designs requiring integrated POR functionality to simplify startup logic. Opt for this series if automotive qualification under AEC-Q100 is mandatory for the target application environment.
This device belongs to the LMx93LV-Q1 family of low-voltage comparators. It serves as a direct replacement for standard LM2xx/LM3xx series parts in low-voltage systems. The LV series offers improved precision and additional features like POR while maintaining compatibility with existing footprints. It complements other TI automotive analog components for complete system solutions.
The LM393LVDRQ1 is a verified alternative in the same SOIC-8 package. For quad-channel requirements, consider the LM339LVQDRQ1. Standard LM393 devices may require level shifting due to lack of rail-to-rail inputs. Verify thermal performance differences between VSSOP-8 and SOIC-8 packages if heat dissipation is critical.