LM4808LD

Audio Amplifiers Overview

The LM4808LD is a low-voltage, dual audio power amplifier featuring integrated volume control. Designed for headphone applications, it delivers high-quality amplification in an 8-WSON package measuring 2.5x2.5 mm. The device operates on a supply voltage range of 2V to 5.5V and provides a maximum output power of 150mW per channel into a 16-ohm load. It utilizes Class AB topology and includes depop circuitry to minimize switching noise.

Audio Amplifiers Feature Summary

• Integrated volume control functionality
• Low-voltage operation suitable for portable devices
• Depop circuitry for noise reduction

Audio Amplifiers Applications

• Headphone amplification
• Portable media players
• Mobile phones

Audio Amplifiers Procurement Notes

Verify the specific suffix (e.g., LD vs LDX) against the required package type, as variations exist between WSON and LLP formats. Confirm RoHS compliance status, as some variants may carry different environmental certifications. Ensure the supplier source aligns with Texas Instruments or authorized distributors for authenticity, given the National Semiconductor acquisition history.

Audio Amplifiers Selection Notes

Select this component when a compact stereo amplifier with built-in gain adjustment is required for battery-powered systems. The 8-WSON footprint offers space efficiency compared to larger SOP packages. Consider the 150mW output capability relative to the target speaker impedance to ensure adequate drive levels without distortion.

Audio Amplifiers Part Context

This part belongs to the Boomer series of audio amplifiers from National Semiconductor, now under Texas Instruments. The series focuses on low-power, high-efficiency solutions for consumer electronics. The LM4808 variant specifically targets applications requiring minimal external components and integrated control features.

Audio Amplifiers Replacement Considerations

LM4808M is a pin-compatible alternative in an SOP-8 package. LM4808LD/NOPB denotes the lead-free version of the same device. Verify package dimensions and thermal characteristics when substituting between WSON and SOP forms.