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LM4898LD/NOPB is listed in the Audio Amplifiers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC AMP CLASS AB MONO 1.4W 10WSON. Review the specifications below when checking this part for your BOM.
The LM4898LD/NOPB is a fully differential audio power amplifier designed for mobile phones and portable communication devices. It delivers 1W continuous average power to an 8Ω BTL load from a 5VDC supply with less than 1% THD+N, or 1.4W minimum to a 4Ω load at 5V. Operating on a single supply of 2.4V to 5.5V, it eliminates the need for output coupling capacitors, snubbers, or bootstrap networks. The device features ultra-low current shutdown mode (0.1µA typical) with high or low selectivity, improved pop and click circuitry, and thermal shutdown protection.
Verify the specific suffix LD indicates the WSON package variant when sourcing replacements. Confirm that the NOPB designation ensures compliance with RoHS standards and absence of lead. Cross-reference the manufacturer's latest datasheet revision to ensure all electrical characteristics match the intended design requirements before finalizing procurement.
Select this component for applications requiring high output power in minimal space without external filtering components. Ensure the PCB layout accommodates the exposed die attach paddle for optimal thermal dissipation, especially when driving low impedance loads like 4Ω. Verify that the system supply voltage remains within the 2.4V to 5.5V operating range to maintain specified performance levels.
This part belongs to the LM4898 family of Class-AB audio amplifiers manufactured by Texas Instruments. The LM4898 series was engineered specifically for low-voltage, battery-powered portable electronics where minimizing external component count and maximizing output power are critical design constraints.
LM4898MM/NOPB
The LM4898 includes a shutdown mode activated by driving the Shutdown Select pin to the same logic state as the Shutdown Mode pin. The Shutdown Mode pin can be tied permanently to VDD or GND to configure the device for either shutdown-high or shutdown-low operation.
The exposed-DAP must be soldered to a copper pad connected to a large continuous copper plane acting as a heat sink. For 5V operation with a 4Ω load, a minimum heatsink area of 2.5 square inches on the same layer is recommended to prevent thermal shutdown.
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