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LM7171BIN/NOPB is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC VOLTAGE FEEDBACK 1 CIRC 8DIP. Review the specifications below when checking this part for your BOM.
The LM7171BIN/NOPB is a single-channel high-speed voltage feedback operational amplifier manufactured by Texas Instruments. It features a gain-bandwidth product of 200 MHz and a slew rate of 4.1 kV/µs, enabling performance comparable to current feedback amplifiers while maintaining voltage feedback topology stability. The device operates on supply voltages ranging from 5 V to 15 V (single) or ±2.75 V to ±15 V (dual), with a maximum dual supply of 18 V. Key electrical parameters include an input offset voltage of 7 mV, input bias current of 12 µA, and output drive capability of 140 mA per channel. It exhibits a common-mode rejection ratio of 105 dB and low input voltage noise density of 14 nV/√Hz. The component is housed in an 8-PDIP package for through-hole mounting.
Verify the specific suffix BIN indicates the PDIP-8 through-hole package variant distinct from surface-mount versions. Confirm RoHS compliance status as NOPB denotes lead-free and environmentally friendly construction. Ensure the ordering quantity matches the tube packaging format specified for this package type. Cross-reference the manufacturer part number against official Texas Instruments documentation to validate availability and revision status before finalizing procurement.
Select this component when circuit design requires both high slew rate and voltage feedback simplicity. It is appropriate for applications needing significant output current drive without sacrificing bandwidth. Consider the 8-PDIP package constraints if PCB layout mandates through-hole technology. Evaluate power supply requirements against the 6.5 mA operating current to ensure thermal management aligns with system specifications.
This device belongs to the LM7171 series of high-speed amplifiers based on Texas Instruments' VIP III complementary bipolar process. The series is designed for video and general-purpose high-speed applications requiring large signal bandwidth. The BIN/NOPB designation specifically identifies the through-hole DIP version with green molding compound and lead-free termination, distinguishing it from SOIC or MSOP variants within the same functional family.
Publicly confirmed substitutes include LM7171AIMX/NOPB for surface-mount integration. Verify pin compatibility and thermal characteristics when transitioning between package types. No direct drop-in replacements are documented for identical performance metrics in alternative packages.
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