LMH6609 MDC

LMH6609 MDC

$1.36
  • Description:IC OPAMP VFB 1 CIRCUIT DIESALE
  • Series:VIP10™
  • Mfr:Texas Instruments
  • Package:Tube

SKU:8b1bb66b7334 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC OPAMP VFB 1 CIRCUIT DIESALE
  • Series:VIP10™
  • Mfr:Texas Instruments
  • Package:Tube
  • Amplifier Type:Voltage Feedback
  • Number of Circuits:1
  • Output Type:-
  • Slew Rate:1400V/µs
  • Gain Bandwidth Product:-
  • Current - Input Bias:2 µA
  • Voltage - Input Offset:800 µV
  • Current - Supply:7mA
  • Current - Output / Channel:90 mA
  • Voltage - Supply Span (Min):6 V
  • Voltage - Supply Span (Max):12 V
  • Operating Temperature:-40°C ~ 85°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Diesale
  • -3db Bandwidth:900 MHz

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LMH6609 MDC

Overview

The LMH6609MDC is a single-channel voltage feedback operational amplifier manufactured by Texas Instruments. It features a gain-bandwidth product of 260 MHz and a slew rate of 1400 V/µs. The device operates on dual supply voltages ranging from 3.3 V to 6 V, with a maximum total supply of 12 V. Key electrical parameters include an input offset voltage of 3.5 mV, input bias current of 8 µA, and output current capability of 90 mA per channel. Common-mode rejection ratio is specified at 73 dB, while power supply rejection ratio reaches 67 dB. Input noise current density is 1.6 pA/√Hz. The component functions within a temperature range of -40°C to +85°C.

Feature Summary

  • High-speed voltage feedback architecture designed for wideband signal processing applications
  • Capable of delivering high output drive current for demanding load conditions
  • Optimized for low distortion performance in video and RF signal chains

Applications

  • Video buffering and distribution systems
  • RF signal conditioning circuits
  • High-speed data acquisition front-ends

Procurement Notes

Verify the specific suffix MDC indicates a die configuration rather than a standard packaged component. Confirm compatibility with wire-bonding or flip-chip assembly processes required for bare die integration. Ensure handling procedures meet electrostatic discharge standards for exposed silicon devices. Validate that the supplier provides traceability documentation for semiconductor wafers.

Selection Notes

Select this component when a bare-die solution is required to minimize parasitic effects in ultra-high-frequency designs. Compare against packaged variants like the LMH6609MF/NOPB if surface-mount assembly is preferred over direct die attachment. Consider the trade-off between board space savings and the complexity of custom packaging solutions.

Part Context

This part belongs to the LMH6609 series of high-speed operational amplifiers from Texas Instruments. The series is characterized by its voltage feedback topology and suitability for broadband applications. The MDC designation distinguishes it as a die-level product, differing from the standard SOT-23-5 packaged versions available in the same family.

LMH6609 MDCLMH6609 MDC
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