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LMH6715 MDC is listed in the Video Amps And Modules range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC AMP CURRENT FEEDBACK DIESALE. Review the specifications below when checking this part for your BOM.
The LMH6715 MDC is a dual wideband video operational amplifier die from Texas Instruments. It features a gain-bandwidth product of 480 MHz and a 3dB bandwidth of 400 MHz. The device offers a slew rate of 1.3 kV/us and an output current of 70 mA per channel. Input specifications include a bias voltage of 6 mV and input bias current of 12 uA. Operating power current is 5.8 mA with supply voltages ranging from 5 V to 6 V. CMRR is 50 dB to 56 dB, and PSRR is 46 dB. Input voltage noise density is 3.4 nV/sqrt Hz. It operates between -40 C and +85 C.
Verify the specific suffix MDC indicates a bare die format rather than a packaged component. Confirm compatibility with wire bonding or flip-chip assembly processes required for die-level integration. Ensure handling procedures meet electrostatic discharge standards for unprotected semiconductor substrates. Validate that the supplier provides traceability documentation consistent with Texas Instruments manufacturing records.
Select this component when dual-channel high-speed video amplification is required in a minimal footprint. Consider the die form factor if custom packaging or system-in-package integration is planned. Evaluate the 1.3 kV/us slew rate against signal transition requirements. Assess the 5.8 mA quiescent current against total system power budgets compared to single-channel alternatives.
This part belongs to the LMH6715 series of wideband video amplifiers. It is the die version of the LMH6715MAX/NOPB SOIC-8 package. The series is designed for professional video applications requiring precise gain and phase linearity. It shares core electrical characteristics with other members of the family but differs in physical implementation.
The LMH6715MAX/NOPB is the packaged equivalent offering identical electrical performance in an 8-SOIC housing. Verify pinout compatibility if transitioning between die and surface-mount packages. No direct pin-for-pin die substitutes are documented in public sources.
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