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LMP92018SQX/NOPB is listed in the ADCs/DACs - Special Purpose range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC ANLG MON/CTRL 10BIT 36WQFN. Review the specifications below when checking this part for your BOM.
The LMP92018SQX/NOPB is an integrated analog system monitor and controller manufactured by Texas Instruments. It combines a multichannel analog-to-digital converter (ADC) and digital-to-analog converter (DAC) within a single package, designed for precise monitoring and control applications. The device operates over an extended industrial temperature range of -40°C to +125°C and utilizes a 36-pin WQFN package. Key electrical specifications include a supply voltage range typically spanning from 2.7V to 5.5V, with low power consumption characteristics suitable for battery-operated or energy-efficient systems. The component supports I2C interface communication for configuration and data retrieval.
Verify the specific suffix 'SQX' against the manufacturer's latest datasheet to confirm package type and tape/reel specifications. Ensure compatibility with the target PCB footprint for the 36-WQFN package. Check for any recent product change notifications that may affect pinout or electrical parameters before finalizing procurement.
Select this component when both high-resolution analog monitoring and precise analog output control are required in a compact form factor. Consider the I2C addressability and channel count relative to system complexity. Evaluate thermal performance under maximum load conditions given the dense WQFN packaging and extended temperature rating requirements.
This part belongs to the LMP9201x family of analog system monitors and controllers. It shares functional similarities with other members like the LMP92018SQ/NOPB but differs in packaging and reel configuration. The 'X' suffix typically denotes a specific tape and reel quantity or variant optimized for automated assembly processes.
Direct replacements within the same family include LMP92018SQ/NOPB, subject to package verification. Cross-family alternatives should be evaluated based on channel count, resolution, and interface compatibility. Ensure thermal and mechanical constraints are met when substituting with different package types.
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