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The LMV393MUTAG is a dual-channel, general-purpose, low-voltage analog comparator manufactured by onsemi. It operates within a supply voltage range of 2.7 V to 5.0 V and features an input common-mode voltage range that extends to ground. The device utilizes an open-drain output configuration suitable for wired-OR applications. Key electrical characteristics include a typical propagation delay of 200 ns at 5 V, a maximum input offset voltage of 9 mV, and a quiescent current of 250 µA per channel at 5 V. It is housed in an 8-pin UDFN package (1.8x1.2 mm) and supports an operating temperature range from -40°C to +85°C.
Verify the specific ordering suffix 'G' indicates a Pb-Free package compliant with RoHS standards. Confirm the package type matches the required UDFN8 footprint dimensions. Ensure the operating temperature range aligns with system requirements, as this variant is rated for -40°C to +85°C. Cross-reference the datasheet revision history for any recent updates to electrical characteristics or mechanical drawings before finalizing procurement specifications.
Select the LMV393MUTAG when space constraints require a compact dual comparator solution. It is appropriate for designs requiring low power consumption and operation from single low-voltage supplies. The open-drain output necessitates an external pull-up resistor; ensure the selected resistor value balances drive capability with power dissipation. Consider the input offset voltage and propagation delay specifications against signal speed requirements.
The LMV393MUTAG belongs to the LMV3xx family, which includes single (LMV331), dual (LMV393), and quad (LMV339) channel comparators. These devices are CMOS-based low-voltage alternatives to industry-standard bipolar comparators like the LM339 and LM393. The family shares similar electrical performance profiles but varies in channel count and available package options such as SC-70, SOIC, and Micro8.
Direct pin-compatible replacements within the same family include the LMV393DR2G (SOIC-8) and LMV393DMR2G (Micro8). Verify that alternative packages meet the thermal resistance and physical dimension constraints of the existing design.