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The LMV7239M7/NOPB is a dual, low-voltage, rail-to-rail input and output operational amplifier manufactured by Texas Instruments. Designed for single-supply operation, it features a wide bandwidth of 10 MHz and a slew rate of 15 V/µs. The device operates with supply voltages as low as 2.5 V, drawing a quiescent current of 1.4 mA per channel. It offers high output drive capability and maintains stability with capacitive loads up to 100 pF. Packaged in a compact SOT-23-8 format, it supports applications requiring precision signal processing in portable electronics.
Verify the complete part number including the suffix /NOPB to ensure lead-free compliance and specific tape-and-reel packaging configuration. Confirm the manufacturer source directly from Texas Instruments or authorized distributors to avoid counterfeit components. Check the latest datasheet revision for any updates to electrical characteristics or recommended operating conditions before finalizing procurement specifications.
Select this component when rail-to-rail performance is required at supply voltages below 5 V. Compare bandwidth and slew rate against higher-speed alternatives if signal fidelity at high frequencies is critical. Evaluate power consumption requirements against other low-power op-amps in the family. Ensure the SOT-23-8 package fits within the available PCB area constraints of the target design.
This device belongs to the LMV series of low-voltage operational amplifiers from Texas Instruments. The series includes single, dual, and quad variants sharing similar electrical characteristics but differing in channel count and package options. The LMV7239 specifically provides dual-channel functionality, making it suitable for differential signaling or dual-channel filtering applications where space and power efficiency are prioritized over ultra-high speed performance.
Direct replacements include the LMV7239M/NOPB (SOIC-8 package) for board layout compatibility adjustments. The LMV7239QMLVH is available for military-grade reliability requirements. Verify pinout compatibility and thermal performance when substituting packages. Cross-reference electrical parameters such as offset voltage and noise density to ensure functional equivalence in the specific application circuit.