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LMX2430TMX/NOPB is listed in the Clock Generators, PLLs, Frequency Synthesizers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC PLL FREQ SYNTH 20TSSOP. Review the specifications below when checking this part for your BOM.
The LMX2430TMX/NOPB is a dual high-frequency synthesizer from Texas Instruments, designed for RF personal communications. It integrates two PLLatinum synthesizers operating in distinct frequency bands: one covering 3.0 GHz and the other 0.8 GHz. The device utilizes Silicon (Si) technology and supports an input frequency range from 250 MHz to 3 GHz, with output frequencies spanning 250 MHz to 3 GHz. It operates on a supply voltage between 2.25 V and 2.75 V. The component is housed in a TSSOP-20 surface-mount package and functions within a temperature range of -40°C to +85°C.
Verify the exact ordering suffix against the manufacturer's current datasheet to ensure compatibility with specific packaging or environmental requirements. Confirm that the TSSOP-20 footprint matches the target PCB layout. Check for any recent lifecycle status updates or obsolescence notices directly from Texas Instruments before finalizing procurement plans.
Select this component when dual-channel frequency synthesis is required within the 250 MHz to 3 GHz range. Ensure the system power supply can maintain the specified 2.25 V to 2.75 V window. Verify that the thermal environment remains within the -40°C to +85°C operational limits. Compare pinout and package dimensions against alternative LMX2430 variants if space constraints are critical.
This part belongs to the LMX2430 family of PLLatinum dual high-frequency synthesizers. It shares core architectural features with variants like the LMX2430SLEX/NOPB but differs in package type, utilizing TSSOP-20 instead of ULGA-20. The TMX suffix typically indicates tape and reel packaging for automated assembly processes.
The LMX2430SLEX/NOPB serves as a functional equivalent within the same family, offering identical electrical performance but packaged in a 20-ULGA format. Substitution requires verifying mechanical fit and re-evaluating thermal dissipation characteristics due to the different package geometry.
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