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LP87522ERNFRQ1 is listed in the Voltage Regulators - DC DC Switching Regulators range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC REG BUCK ADJ 4A/9A DL 26VQFN. Review the specifications below when checking this part for your BOM.
The LP87522ERNFRQ1 is an automotive-grade power management IC featuring four integrated step-down DC/DC converter cores. It comprises three high-current phases and one auxiliary phase, delivering up to 10 A total output current. The device operates with an input voltage range supporting standard automotive loads and provides adjustable output voltages from 600 mV to 3.36 V. It is housed in a VQFN-HR (RNF) package with 26 terminals, designed for high thermal performance and compact board space.
Verify the complete orderable part number LP87522ERNFRQ1 against the specific suffix requirements for your design. Confirm that the VQFN-HR package dimensions match your PCB layout constraints. Ensure the selected variant meets the required AEC-Q100 Grade 1 qualification level for your target automotive environment.
Select this component when designing systems requiring high current density from multiple regulated rails within a single package. The integrated switch architecture reduces external inductor and capacitor requirements compared to discrete solutions. Consider the thermal dissipation characteristics of the VQFN-HR package during the initial layout phase to ensure reliable operation at maximum load conditions.
This device belongs to the LP8752x-Q1 family of automotive power management ICs. These devices are engineered specifically for complex electronic control units in vehicles. The family offers various configurations of buck converters to suit different power budget requirements while maintaining small form factors suitable for dense automotive electronics assemblies.
Consult Texas Instruments documentation for direct pin-to-pin compatible alternatives within the LP8752x series. Verify that any substitute part maintains the same AEC-Q100 qualification status and package outline dimensions to ensure mechanical interchangeability without redesigning the printed circuit board.
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