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LPC2925FBD100,551 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MCU 16/32B 512KB FLSH 100LQFP. Review the specifications below when checking this part for your BOM.
The LPC2925FBD100,551 is an ARM9-based microcontroller featuring a 125 MHz ARM968E-S core. It integrates 512 kB flash memory, 40 kB SRAM (including two 16 kB blocks), and 16 kB EEPROM. The device includes dual 10-bit ADCs, USB 2.0 full-speed controller, dual CAN, dual LIN, three Q-SPIs, and two UARTs with RS-485 support. It operates on a dual power supply of 1.8 V for the core and 3.3 V for I/O within a 100-pin LQFP package.
Verify the specific ordering suffix ',551' against official NXP documentation to confirm tape-and-reel packaging or specific environmental ratings. Ensure compatibility with existing board designs regarding the 100-pin LQFP footprint and dual voltage requirements (1.8V core, 3.3V I/O). Confirm that the component meets the required operating temperature range of -40 °C to +85 °C for your application environment.
Select this MCU when high code density and performance are needed from an ARM9 architecture. The inclusion of both CAN and LIN controllers makes it suitable for mixed-network environments. Consider the 512 kB flash capacity for complex applications. Evaluate the dual power supply requirement (1.8V/3.3V) during power budgeting and PCB layout planning compared to single-supply alternatives.
This part belongs to the LPC292x family, which combines ARM968E-S cores with extensive peripheral sets. It serves as a bridge between high-performance processing and cost-effective integration for networking and control tasks. The family shares architectural similarities with other ARM9 MCUs but distinguishes itself through integrated LIN and USB capabilities alongside traditional industrial interfaces.
No direct public substitute part numbers are confirmed in the provided documentation. Migration to newer NXP families may require significant software and hardware redesign due to architectural differences between ARM9 and modern Cortex-M cores.
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