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LPTM10-12107-3FTG208I is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists Lattice Semiconductor Corporation. Its product description is IC PLATFORM MANAGER 208FTGBA. Review the specifications below when checking this part for your BOM.
The LPTM10-12107-3FTG208I is a General Purpose Power Management Integrated Circuit (PMIC) from the Lattice Platform Manager series. It integrates board power management functions including hot-swap control, sequencing, monitoring, reset generation, trimming, and clock management. The device features 107 total I/Os and operates at a supply voltage of 3.3V. It is housed in a 208-ball FTBGA package with dimensions of 17x17 mm.
Verify the specific suffix 'I' indicates the industrial temperature grade as per official datasheets. Confirm the 208-ball FTBGA package type matches the design requirements. Ensure compatibility with the 3.3V operating voltage specified for this part number. Cross-reference the manufacturer's latest documentation to confirm current production status and any potential PCNs affecting the component.
Select this component when a dedicated PMIC integrating multiple power management functions is required. The high pin count supports complex board architectures needing extensive I/O for monitoring and control. Consider the 208-ball FTBGA package constraints during PCB layout. Verify that the 3.3V supply rail aligns with the system's power distribution network before integration.
This part belongs to the LPTM10 series of Platform Managers from Lattice Semiconductor. These devices are designed to replace discrete power management components by integrating multiple functions into a single configurable IC. The series typically offers flexibility through non-volatile configuration options to adapt to various board-level power requirements.
Publicly confirmed substitute part numbers are not available in the provided source material. Consult Lattice Semiconductor directly for qualified alternates or updated product line information.
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