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LSMGA160808T102RG is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Taiyo Yuden. Its product description is FERRITE BEAD 1 KOHM 0603 1LN. Review the specifications below when checking this part for your BOM.
The LSMGA160808T102RG is a surface-mount ferrite chip bead from the TAIYO YUDEN LCMG series, designed for high-current applications. It features a 0603 (1608 metric) package with dimensions of 1.6 mm length, 0.8 mm width, and 0.8 mm height. The component provides an impedance of 1 kOhms at a test frequency of 100 MHz with a tolerance of ±25%. It supports a maximum DC current of 600 mA and has a maximum DC resistance of 350 mOhms. The operating temperature range spans from -40°C to +125°C.
Verify the specific suffix 'RG' against the manufacturer's latest datasheet to confirm packaging type and tape/reel specifications. Ensure the ordered quantity aligns with the factory pack quantity of 4000 units if purchasing directly from production lines. Cross-reference the impedance value of 1 kOhms at 100 MHz with circuit simulation requirements to validate performance under actual load conditions.
Select this component when high DC current capacity is required alongside significant impedance at 100 MHz. The 0603 package size offers a balance between current handling and board space efficiency compared to smaller packages. Consider the 350 mOhms DC resistance impact on voltage drop in low-voltage power rails before finalizing the design choice.
This part belongs to the LCMG series of ferrite beads from TAIYO YUDEN, which are engineered for general-purpose EMI suppression. The series utilizes advanced multilayer ceramic technology to provide stable electrical characteristics across varying temperatures and bias currents, making it suitable for both industrial and consumer electronics applications.
Consult official substitution guides for equivalent parts within the same impedance and current rating class. Verify that any alternative component matches the 0603 footprint and thermal characteristics to ensure mechanical compatibility without redesigning the PCB layout.
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