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LSMGA201616T251NG is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Taiyo Yuden. Its product description is FERRITE BEAD 250 OHM 0806 1LN. Review the specifications below when checking this part for your BOM.
The LSMGA201616T251NG is a high-current ferrite chip bead from the LMG series, manufactured by Taiyo Yuden. It features an impedance of 250 Ohms at a test frequency of 100 MHz with a tolerance of 30%. The component supports a maximum DC current of 2 A and has a maximum DC resistance of 50 mOhms. It operates within a temperature range of -40°C to +125°C. The physical dimensions are 2.0 mm in length, 1.6 mm in width, and 1.6 mm in height, corresponding to the 0806 (2016 metric) surface-mount package.
Verify the specific suffix 'NG' against official Taiyo Yuden documentation to confirm material composition and compliance status. Ensure the selected packaging format matches production requirements. Confirm that the 2 A current rating aligns with the thermal management capabilities of the target circuit design before finalizing procurement.
Select this component when a 250 Ohm impedance at 100 MHz is required for EMI suppression in high-current environments. The 0806 footprint offers a balance between current handling capacity and board space efficiency. Verify that the 50 mOhms DC resistance meets the voltage drop constraints of the specific power rail being filtered.
This part belongs to the LMG series of ferrite beads, which are engineered for robust performance in demanding electronic environments. Taiyo Yuden utilizes proprietary raw materials and manufacturing technologies to ensure consistency and reliability in these passive components, targeting applications where stable electrical characteristics under load are critical.
Publicly confirmed substitute part numbers for this specific model are not available in the provided source data. Cross-referencing with other manufacturers requires independent verification of impedance curves, current ratings, and physical dimensions to ensure functional compatibility.
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