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LSQPA251818T220M is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Taiyo Yuden. Its product description is FIXED IND 22UH 460MA 1.001OHM SM. Review the specifications below when checking this part for your BOM.
The LSQPA251818T220M is a semi-shielded wirewound power inductor from Taiyo Yuden, housed in a 1007 (2518 metric) surface-mount package measuring 2.5 x 1.8 x 1.8 mm. It features an inductance of 22 µH with a tolerance of ±20%. The component has a maximum DC current rating of 460 mA and a maximum DC resistance of 1.001 Ohms. It operates within a temperature range of -40°C to +105°C and exhibits a self-resonant frequency of 19 MHz.
Verify the specific suffix and manufacturer documentation when sourcing. Confirm that the component meets required thermal and current specifications for the target application. Ensure compatibility with standard surface-mount reflow processes. Check for any updated replacement part numbers or series designations provided by the manufacturer prior to finalizing procurement plans.
Select this component for applications requiring compact power filtering with moderate current handling capabilities. The semi-shielded design helps minimize magnetic field interference with nearby components. Evaluate the 460 mA current rating against peak load requirements. Consider the 1.001 Ohm DC resistance impact on overall circuit efficiency and voltage drop during operation.
This part belongs to the LSQPA series of fixed inductors from Taiyo Yuden. It serves as a successor or variant within the broader CB/LSQ family of power inductors designed for consumer electronics. The 1007 package size provides a balance between electrical performance and board space utilization for portable devices.
Public records indicate LSQNA251818T220M as a previous part number associated with similar specifications. Verify cross-compatibility with LSQPA series variants before substitution. Consult official manufacturer documentation to confirm pinout and parameter equivalence for direct replacement scenarios.
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