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LT1009IPWG4 is listed in the Voltage Reference range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC VREF SHUNT 0.4% 8TSSOP. Review the specifications below when checking this part for your BOM.
The LT1009IPWG4 is a precision shunt voltage reference manufactured by Texas Instruments, delivering a nominal output of 2.5 V. It features an initial accuracy of 0.2% and a temperature coefficient of 25 PPM/°C. The device operates within a junction temperature range of -40°C to +85°C. Electrical specifications include a maximum shunt current of 10 mA and a minimum operating current of 400 µA. It is housed in an 8-pin TSSOP surface-mount package.
Verify the component authenticity against the official Texas Instruments datasheet specifications. Confirm that the TSSOP-8 package matches your PCB footprint requirements. Ensure the thermal management design supports the specified operating temperature range of -40°C to +85°C. Cross-reference the ordering suffix to confirm compliance with RoHS standards and lead-free manufacturing processes before finalizing procurement.
Select this component when a fixed 2.5 V reference is required with tight tolerance constraints. The 0.2% initial accuracy makes it suitable for applications demanding high precision without external trimming. Consider the 400 µA minimum current requirement to ensure proper regulation during operation. The TSSOP-8 package offers a space-efficient solution for dense circuit board layouts compared to through-hole alternatives.
This part belongs to the LT1009 series of integrated reference circuits from Texas Instruments. It serves as a drop-in replacement for legacy components like the LM236-2.5 in many designs. The 'G4' suffix indicates a specific manufacturing revision compliant with environmental standards. It is categorized under PMIC voltage references within the broader power management portfolio.
The LT1009IDR and LT1009CD are documented equivalents within the same family. Verify pin compatibility and thermal performance when substituting between SOIC and TSSOP packages.
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