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LT1107CN8-12#PBF is listed in the Voltage Regulators - DC DC Switching Regulators range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC REG BUCK BOOST 12V 1.5A 8PDIP. Review the specifications below when checking this part for your BOM.
The LT1107CN8-12#PBF is a micropower DC/DC converter manufactured by Analog Devices Inc., housed in an 8-pin PDIP package. It provides a fixed 12V output with a maximum switch current of 300mA. The device supports boost, buck, and inverting topologies. Input voltage ranges from 2V to 12V for step-up mode and up to 30V for step-down mode. Key electrical parameters include a switching frequency of 63kHz, a maximum input voltage of 30V, and a quiescent current of 550µA. Operating temperature range is 0°C to +70°C.
Verify the specific suffix CN8 indicates the PDIP package variant when sourcing. Confirm the -12 suffix corresponds to the fixed 12V output requirement. Ensure compatibility with the required operating temperature range of 0°C to +70°C. Cross-reference the manufacturer part number LT1107CN8-12#PBF with official Analog Devices documentation to confirm RoHS compliance and pinout configuration before integration.
Select this component for applications requiring a fixed 12V output from varying input sources. Consider the 300mA output current limit for load requirements. Evaluate the 63kHz switching frequency against EMI constraints. Compare input voltage ranges (2V-12V boost vs 30V max buck) against the specific power supply architecture. Ensure the through-hole PDIP package fits the PCB layout constraints.
This part belongs to the LT1107 series of micropower DC/DC converters. It shares functional similarities with other variants like the LT1107CS8-12#PBF but differs in packaging. The series is designed for efficiency with minimal external component count. It serves as a solution for simple voltage regulation tasks in space-constrained designs.
LT1107CS8-12#PBF offers identical electrical performance in an SOIC-8 surface-mount package. Verify pin compatibility and thermal dissipation differences between PDIP and SOIC packages when substituting.
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