LT3383HUJM#TRPBF

LT3383HUJM#TRPBF

$6.50
  • Description:IC REG QD BUCK/LNR 2.25MHZ 40QFN
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tape & Reel (TR)

SKU:e6119e4f6711 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC REG QD BUCK/LNR 2.25MHZ 40QFN
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tape & Reel (TR)
  • Topology:Step-Down (Buck)
  • Number of Outputs:4
  • Frequency - Switching:2.25MHz
  • Voltage/Current - Output 1:0.725V ~ 5.5V, 2.5A
  • Voltage/Current - Output 2:0.725V ~ 5.5V, 2.5A
  • Voltage/Current - Output 3:1.8V, 1.5A
  • w/LED Driver:No
  • w/Supervisor:No
  • w/Sequencer:No
  • Voltage - Supply:2.7V ~ 5.5V
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount, Wettable Flank
  • Package / Case:40-WFQFN Exposed Pad
  • Supplier Device Package:40-QFN (6x6)
  • Grade:-
  • Qualification:-

Download product information

LT3383HUJM#TRPBF

Overview

The LT3383HUJM#TRPBF is a multi-output power management integrated circuit from Analog Devices, designed for advanced portable application processor-based systems. It integrates four synchronous step-down DC/DC converters and three low-dropout (LDO) linear regulators within a single package. The device supports an input voltage range of 2.7V to 5.5V and operates in a 40-pin QFN EP package. This solution consolidates multiple power rails required by complex system-on-chip architectures into a compact form factor.

Feature Summary

  • Integrates four synchronous buck converters and three LDO regulators
  • Designed for advanced portable application processor systems
  • Supports wide input voltage range from 2.7V to 5.5V

Applications

  • Portable application processor-based systems
  • Advanced mobile devices requiring multiple power rails
  • Complex system-on-chip power distribution networks

Procurement Notes

Verify the specific suffix #TRPBF indicates tape-and-reel packaging when ordering. Confirm the HUJM variant meets the required temperature grade for your environment. Ensure compatibility with existing board layouts due to the 40-pin QFN EP footprint. Cross-reference the datasheet for thermal performance requirements under maximum load conditions.

Selection Notes

Select this component when a high-density power solution is needed for processors requiring multiple distinct voltage levels. The integration of both switching regulators and LDOs allows for efficient bulk power conversion alongside clean analog supply rails. Consider the thermal dissipation capabilities of the QFN EP package relative to the total output current demands of the four buck and three LDO channels.

Part Context

This part belongs to the LT3383 family of multi-output power management ICs. It serves as a comprehensive power solution for applications that previously required discrete components for each voltage rail. The family includes variants such as the LT3383IUJM#WPBF, which may differ in packaging or temperature rating while maintaining similar functional integration.

Replacement Considerations

Direct substitutes include other parts within the LT3383 family, such as the LT3383IUJM#TRPBF, provided the temperature range and packaging match the design requirements. Verify pin-to-pin compatibility and electrical specifications before substitution.

LT3383HUJM#TRPBFLT3383HUJM#TRPBF
$6.50
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