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The LT3470ETS8#TRMPBF is a micropower step-down DC/DC converter from Analog Devices Inc., housed in an 8-pin TSOT-23 package. It integrates a 300mA power switch, catch diode, and boost diode to minimize external component count. The device operates with an input voltage range of 4V to 40V and provides an adjustable output voltage between 1.25V and 16V. It delivers up to 200mA of output current while maintaining a low quiescent current of 25µA. The converter supports a switching frequency of 1.2MHz and functions within a temperature range of -40°C to +85°C.
Verify that the suffix #TRMPBF corresponds to the specific tape and reel packaging configuration required for your assembly line. Confirm that the automotive grade qualification aligns with your system's reliability standards. Ensure the thermal characteristics of the TSOT-23-8 package are adequate for your enclosure design. Cross-reference the datasheet revision to confirm pinout compatibility with existing footprints.
Select this component when space constraints necessitate an integrated solution with minimal passive components. It is appropriate for applications requiring wide input voltage ranges and adjustable outputs. Consider the 1.2MHz switching frequency for balancing size and noise. Evaluate the 25µA quiescent current against standby power budgets. Verify that the 300mA internal switch rating exceeds peak load demands.
This part belongs to the LT3470 family of micropower buck regulators designed for high-efficiency power management in small form factors. The ETS8 designation indicates the automotive-grade variant in a ThinSOT-23 package. The TRMPBF suffix specifies the reel packaging format compliant with RoHS directives. This series targets applications where board area and battery life are critical design parameters.
LT3470HTS8 is a documented alternative within the same family offering similar functionality in the same package type. Verify electrical parameter equivalence before substitution. Ensure that any replacement maintains the required automotive qualification and thermal performance specifications for your application environment.