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LTC1435CG#TRPBF is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC REG CTRLR BUCK 16SSOP. Review the specifications below when checking this part for your BOM.
The LTC1435CG#TRPBF is a synchronous step-down switching regulator controller manufactured by Analog Devices Inc. It operates within an input voltage range of 3.5 V to 36 V and provides an adjustable output voltage from 1.19 V to 9 V. The device supports a maximum output current of 15 mA with a fixed switching frequency of 125 kHz. It features a quiescent current of 260 uA and maintains a load regulation of 0.5%. The component is housed in a 16-lead SOIC package and functions reliably across an operating temperature range of 0°C to +70°C.
Verify the specific suffix #TRPBF indicates tape-and-reel packaging when ordering. Confirm the CG grade corresponds to the commercial temperature range of 0°C to +70°C. Ensure compatibility with external MOSFET selection for the required current handling. Check manufacturer documentation for any recent product change notifications affecting pinout or electrical characteristics before finalizing procurement.
Select this controller for applications requiring a synchronous buck solution with wide input voltage tolerance. It is suitable where adjustable output voltage and precise load regulation are critical. Consider the 125 kHz switching frequency for balancing size and efficiency. Verify that external components can support the 15 mA output requirement and that the SOIC-16 package fits the PCB layout constraints.
The LTC1435 belongs to Analog Devices' family of high-efficiency, low-noise synchronous step-down switching regulators. This series is designed to drive external power MOSFETs using a fixed-frequency architecture. The controller integrates essential protection and control features to simplify design while maintaining robust performance in demanding power management environments.
The LTC1435CS#TRPBF serves as a direct replacement variant, differing primarily in package type (SOIC vs SSOP) and potentially thermal characteristics. Verify pin-to-pin compatibility and ensure the alternative package meets the thermal dissipation requirements of the application.
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