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Product Detailed Parameters
- Description:16 CHANNEL 12-BIT 15V SOFTSPAN D
- Series:-
- Mfr:Analog Devices Inc.
- Package:Tube
- Number of Bits:12
- Number of D/A Converters:8
- Settling Time:21µs (Typ)
- Output Type:Voltage - Buffered
- Differential Output:No
- Data Interface:SPI
- Reference Type:External, Internal
- Voltage - Supply, Analog:4.75V ~ 5.25V
- Voltage - Supply, Digital:1.71V ~ 5.25V
- INL/DNL (LSB):±0.75 (Max), ±0.25LSB (Max)
- Architecture:-
- Operating Temperature:-40°C ~ 125°C
- Package / Case:40-WFQFN Exposed Pad
- Supplier Device Package:40-QFN (6x6)
- Mounting Type:Surface Mount
- Grade:-
- Qualification:-
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Overview
The LTC2686HUJ-12#PBF is an 8-channel, 12-bit voltage output SoftSpan DAC in a 4.5 mm × 4.5 mm, 64-ball WLCSP package. It features independently programmable output ranges of 0 V to 5 V, 0 V to 10 V, ±5 V, ±10 V, and ±15 V with full resolution at all spans. The device includes a precision internal 4.096 V reference (±10 ppm/°C) and rail-to-rail output buffers capable of sourcing or sinking up to ±55 mA. Key specifications include a maximum INL error of ±0.75 LSB, a settling time of 3.5 µs for a ±15 V step, and operation over a temperature range of -40°C to +125°C.
Feature Summary
- Eight independent channels with individually programmable SoftSpan output ranges up to ±15 V
- Integrated precision 4.096 V reference with ±10 ppm/°C temperature coefficient
- Rail-to-rail output drivers guaranteeing ±55 mA source/sink current capability
- Built-in analog multiplexer for monitoring output voltages, load currents, and junction temperature
Applications
- Optical networking systems
- Automatic test equipment
- Process control and industrial automation
Procurement Notes
Verify the specific suffix HUJ corresponds to the 64-ball WLCSP package variant when sourcing. Confirm that the procurement channel provides documentation supporting the H-grade operating temperature range (-40°C to +125°C). Ensure compatibility with the required IOVCC logic levels for the SPI interface.
Selection Notes
Select this component for designs requiring high channel density in a minimal footprint. The WLCSP package is suitable for space-constrained PCB layouts. Verify that the external supply rails can support the maximum ±15 V range if bipolar outputs are utilized. Consider the thermal resistance characteristics of the WLCSP package during power dissipation analysis.
Part Context
This part belongs to the LTC2686 family of SoftSpan DACs, which also offers 16-bit resolution variants and LFCSP packaging options. The HUJ suffix specifically identifies the 64-ball Wafer-Level Chip Scale Package configuration. This distinguishes it from the standard LFCSP versions while maintaining identical electrical performance and pinout functionality across the series.
Replacement Considerations
Direct substitutes within the same family include the LTC2686HUJ-16#PBF for higher resolution requirements. For different package constraints, the LTC2686HCUJ-12#PBF (LFCSP) serves as a pin-compatible alternative with adjusted thermal properties.
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